Paste technology
We offer products with heat dissipation properties that have heat spreaders attached using metal plate bonding technology!
Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using our unique metal sheet bonding technology. By appropriately selecting materials and establishing proper bonding conditions with heat spreaders/Cu foils, we can achieve products with extremely low warpage. Additionally, by bonding rigid substrates with sealing frames and rigid substrates with Cu foils, we can realize package structures that are difficult to achieve with conventional multilayer designs. 【Features】 ■ Proven track record in bonding heat spreaders/Cu foils ■ Achieves high heat dissipation ■ High freedom in height and width, ensuring stable shapes *For more details, please refer to our catalog or feel free to contact us.
- Company：日本ミクロン
- Price：Other
